Meco Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net

Features: Efficient: quick alignment for operating of reballing Easy: positioning pins for precise alignment Durable: Long Time Operating and Usage Lifetime Application Model: iphone 6s Plus, 6s Function: Repairing or fixing problem of iphone 6s Plus 6s processor Package includes: 1 x BGA Reballing Stencils for iPhone 6s/6SP Details pictures: